2024 TPCA Dongjie Advanced Carrier Circuit Process Solution

The 2024 Taiwan Printed Circuit Board Exhibition (TPCA) grandly opened on October 23rd. Dongjie Technology (8064.TW) will showcase its "Advanced Glass Carrier Process Solutions," particularly high-precision glass carrier through-hole (TGV), glass laser cutting, and 3D automated optical inspection technologies. Dongjie Technology's cutting-edge technologies will be combined with Fulim Technology's leading advantages in TGV seed layer coating and plasma etching equipment. This will further enhance the production efficiency and quality of advanced carrier circuitry processes, supporting next-generation advanced packaging glass core substrates (GCS). Glass substrates are known for their ultra-low flatness, excellent thermal stability, and mechanical stability, which can significantly increase substrate interconnect density. These characteristics enable them to meet the high-load computing demands of the AI ​​era. The technological innovations of Dongjie and Fulim are expected to bring a new wave of business opportunities to the market, driving the growth in equipment demand in the advanced carrier application field.
Dongjie Technology, leveraging its long-standing expertise in glass substrate laser applications within the optoelectronic panel industry, has collaborated with the Industrial Technology Research Institute (ITRI) to launch glass via (TGV) processing technology and equipment solutions based on ultra-short pulse laser modification and wet processing, showcasing industry-leading positioning accuracy and roundness capabilities. Furthermore, Dongjie's dual-axis laser glass cutting equipment, combining ultra-short pulse laser modification and CO2 thermal cracking technology, can rapidly and automatically cut freeform and composite transparent hard and brittle materials, boasting the most extensive application experience in Taiwan. Additionally, Dongjie has launched a 3D automated optical inspection device for RDL (Redistribution Layer) processes. Its superior inspection capabilities in RDL redistribution processes enable automatic 3D measurement and defect classification, becoming a key tool for ensuring process quality and reliability.
Fulim Technology, a leading supplier of vacuum equipment from MIT, will showcase its magnetron sputtering equipment for titanium/copper seed layers and its plasma descum technology in advanced substrate fabrication processes. Its unique microwave plasma and radio frequency integrated design enables faster and more efficient removal of residual resist. This technology supports substrate sizes up to 650mm*650mm, meeting mainstream specifications for advanced packaging and glass substrates, while also responding to ESG policies and committed to reducing material consumption and environmental pollution.
Dongjie Technology stated that its booth will fully showcase its latest achievements in RDL AOI inspection, TGV drilling, glass laser cutting, magnetron sputtering, and plasma etching equipment. These innovative technologies not only improve process efficiency and product performance but also meet the requirements of environmental protection and sustainable development. We sincerely invite you to visit Dongjie Technology's booth (booth number: N-1125) to witness the latest technologies and innovations in advanced substrate manufacturing processes.