Recently, Hangzhou Xinju Semiconductor Co., Ltd. (hereinafter referred to as "Xinju Semiconductor") officially launched its 50,000 KK Micro LED MiP R&D and production project in Heda Core Valley. The project has a total investment of 1 billion yuan, and is expected to generate an annual output value of nearly 1 billion yuan after reaching full production capacity. It will also complement the technology of local upstream and downstream companies in the industrial chain, such as Silan Microelectronics and Meditech Optoelectronics.
Image source: Heda Core Valley
The founder of Chipplus Semiconductor stated that in the future, the company will use its Hangzhou base as a fulcrum to accelerate the popularization and application of Micro LED products in commercial displays, large-screen TVs, automotive displays, and other fields.
According to public information, Xinju Semiconductor was established on January 18, 2024. Its business scope includes general items such as: manufacturing of semiconductor lighting devices; sales of special equipment for semiconductor devices; sales of semiconductor lighting devices; manufacturing of optoelectronic devices; sales of optoelectronic devices; manufacturing of display devices; sales of display devices; manufacturing of integrated circuit chips and products, etc.
MiP Technology Continues to Evolve <br /> In recent years, MiP packaging technology has gradually emerged in the LED display industry, becoming an important force driving industry transformation. According to forecasts, the LED packaging market for displays will reach approximately US$1.3 billion in 2024, and MiP technology is expected to experience rapid growth in 2025, potentially boosting the output value of LED packaging for displays.
Besides ChipPower Semiconductor, companies such as Leyard, BOE Huacan, Nationstar Optoelectronics, and Kinglight also regard MiP technology as one of the important directions for future LED packaging and are actively making technological deployments.
In terms of capacity expansion, Leyard announced in November last year that its self-developed high-end MiP production line, with a fully self-developed process, had officially started production, achieving a yield rate of over 95% for its high-end MiP products. The first phase of the production line has a capacity of 1200KK/month, and the capacity of the second phase will be expanded to 2400KK/month in the future, further promoting cost reduction and efficiency improvement of Micro LED display products.
In December of last year, Sanan Optoelectronics' wholly-owned subsidiary, Amped Optoelectronics, announced that it had successfully developed and mass-produced Micro LED devices MiP0404 and MiP0202, as well as Micro LED display panels MiP0.78 and MiP0.9 series products. Currently, Amped Optoelectronics has a monthly MiP production capacity of 2,000 KK and plans to increase it to 5,000 KK/month by the end of 2025.
In addition, Ampco has also partnered with ChipInfo Optoelectronics on Micro LED chip technology, chip-level packaging technology, and mass transfer technology, aiming to promote the coordinated development of the entire industry chain.
In terms of products, on March 19 this year, BOE Huacan Micro LED factory held a product delivery ceremony for the world's first 6-inch Micro LED mass production line in Jinwan District, Zhuhai. At the ceremony, BOE Huacan officially delivered MPD (Micro Pixel Display) products to customers, which are MIP (Micro LED in Package) packaging technology products in the industry.
BOE and HC SemiTek use MPD (Multi-Package Design) products for shipment, which effectively addresses the challenges of COB (Chip-on-Board) packaging. By reducing packaging costs and precision requirements, it enhances the synergistic effect of the upstream and downstream industrial chains in the display chip industry.
In addition, on February 17th of this year, Suzhou Lijin Semiconductor Co., Ltd. released the industry's first silicon-based GaN single-chip integrated full-color Micro-LED chip—LEKIN-SiMiP, and successfully verified its application in direct-view micro-pitch LED large screens in cooperation with several display customers, including HKC. This technology effectively solves the problem of mass transfer and improves the first-pass yield.
It is worth noting that MiP-related technologies and new products were frequently showcased at the ISLE 2025 exhibition held in March this year.
Among them, Lehman Optoelectronics showcased its first product using Micro-level MIP technology. This product's MIP devices, with their high black area and low light-emitting surface, improve the contrast of the COB panel, providing a cool screen experience (low perceived temperature) and features such as waterproofing, dustproofing, anti-static properties, impact resistance, moisture resistance, and mildew resistance. Furthermore, the product boasts higher color fidelity and a true contrast ratio of 20000:1.
