Recently, two studies related to Micro LED technology have been published in academia, showing potential applications in Micro LED mass transfer processes and heat dissipation management.
Seoul National University of Science and Technology (SEOULTECH) has developed a novel adhesion technology inspired by starfish, which may be applicable to Micro LED transfer processes. The journal *Science Advances* reports that SEOULTECH has designed a novel adhesion technology that can effectively and efficiently grasp and place objects in water.
Image source: Journal of Science Advances
The research report showcases a structure consisting of a flexible hydrogel "mouth" and a rigid "foot," fabricated by connecting two cylindrical components with different mechanical properties in series. During water absorption and expansion, the originally straight hydrogel cylinder selectively deforms, transforming into a soft, cup-shaped pad. When it contacts the surface of a target object, it can stretch and expand through deformation, thus achieving effective adhesion. During the separation phase, a vacuum is formed inside the foot, generating a strong underwater adsorption force.
These biomimetic artificial tube feet exhibit high adhesion hysteresis, can be autonomously released in response to external stimuli, and can be rapidly detached via pneumatic actuation through an integrated system. Researchers believe this technology may be adaptable to Micro LED transfer processes. Although no Micro LED-related technologies appear to have been developed yet, further research is anticipated.
Seoul National University of Science and Technology develops novel adhesion technology that may be applicable to Micro LED transfer processes.
According to the ResearchGATE platform, researchers at Shanghai University have developed a graphene heat dissipation film for Micro LEDs. The goal is to optimize the thermal management of Micro LEDs, improve photoelectric conversion efficiency, and reduce the impact of excessive junction temperature on device performance and reliability.
Image source: ResearchGATE
Graphene possesses excellent physical properties such as high transparency and high thermal conductivity, making it an effective solution for thermal management of electronic devices that require both transparency and heat dissipation performance. Research shows that compared to currently commercially available metal films used for heat dissipation in integrated circuits, graphene heat dissipation layers can more efficiently remove heat from devices.
Researchers proposed and tested the application of graphene heat dissipation layers in chip-on-film packaging. Both experimental and theoretical results showed that graphene exhibited more efficient thermal management capabilities compared to metal layers with similar transparency, thus demonstrating its potential for heat dissipation applications in transparent electronic devices.
In addition, researchers are also studying the role of solar radiation. Studies have found that when sunlight directly shines on Micro LED devices, the amount of radiation on the device surface increases dramatically, which may provide a basis for solving the problem of solar backflow. (Translated)
