Recently, Sitan Technology, Raytech Optoelectronics, and Chili Electronics have successively obtained the latest Micro LED patents, involving technologies such as integrated systems, micro display chip fabrication, and pixel addressing of micro display devices.
Sitan Technology: Obtains Patent for Micro-LED Integrated System
On June 17, 2025, information from the State Intellectual Property Office showed that Shenzhen Sitan Technology Co., Ltd. obtained a patent entitled "Integrated System of Micro-LED", with authorization announcement number CN112863430B and application date of February 2021.
Image source: State Intellectual Property Office
This invention discloses an integrated Micro-LED system. The system includes: an FPGA chip for generating control signals; a PCB circuit board including a signal conversion circuit and a power conversion circuit, wherein the signal conversion circuit receives the control signals sent by the FPGA chip, and the power conversion circuit receives the operating voltage transmitted by the FPGA chip and converts the power supply into a low-voltage analog voltage and a low-voltage digital voltage; and a Micro-LED display module including a Micro-LED display array and a Micro-LED driver chip, wherein the Micro-LED driver chip drives the Micro-LED display array to light up according to the control signals sent by the signal conversion circuit and the low-voltage analog voltage and low-voltage digital voltage sent by the power conversion circuit. This invention achieves miniaturized integration of a Micro-LED display system.
Raytech Optoelectronics: Obtained a patent for Micro LED microdisplay chips and their fabrication methods
On June 20, 2025, information from the State Intellectual Property Office showed that Raytech Optoelectronics Technology (Suzhou) Co., Ltd. obtained a patent entitled "Micro LED Microdisplay Chip and its Preparation Method", with authorization announcement number CN119730528B and application date of February 2025.
Image source: State Intellectual Property Office
This invention application relates to the field of display chip technology, proposing a Micro LED microdisplay chip and its fabrication method. The microdisplay chip includes a driving substrate and a light-emitting structure disposed on the driving substrate. The light-emitting structure includes: a plurality of LED units arranged at intervals on the driving substrate, each LED unit being individually driven by the driving substrate, and the plurality of LED units having a plurality of corresponding LED mesa; a first fence structure having a plurality of first grid holes, the plurality of first grid holes respectively surrounding the plurality of LED mesa, and the first fence structure being higher than the plurality of LED units; and an optical layer disposed on the first fence structure, with the LED mesa and the optical layer forming a cavity region at the corresponding first grid holes. Forming the cavity region with a simple process reduces the heat conduction of the LED units to the light conversion structure above, not only improving the lifespan of the microdisplay chip but also reducing manufacturing costs.
Chili Electronics: Obtained patents related to pixel addressing in ultra-high pixel density Micro-LED microdisplay devices
On June 20, according to information from the State Intellectual Property Office, Shenzhen Qili Electronics Technology Co., Ltd. obtained a patent entitled "Pixel Addressing Method and Device for Ultra-High Pixel Density Micro-LED Microdisplay Devices", with authorization announcement number CN119785703B and application date of March 2025.
Image source: State Intellectual Property Office
This invention relates to a pixel addressing method and apparatus for ultra-high pixel density Micro-LED microdisplay devices. The method includes: acquiring compensation parameters for the pixel array structure parameters of the Micro-LED microdisplay device to obtain pixel compensation reference values; constructing a compensation network based on the threshold voltage deviation distribution characteristics to obtain a threshold voltage compensation network; segmenting the power supply metal traces to obtain IR Drop compensation parameters; performing process compensation calculations using a Markov decision inference model with a two-layer compensation factor to obtain process compensation data; optimizing the timing of addressing control to obtain row and column scanning signal timing parameters; testing the photoelectric characteristics of the row and column scanning signal timing parameters, acquiring display uniformity data, and obtaining target compensation configuration parameters through compensation parameter evaluation. The implementation of this invention ensures the stability of the driving timing while reducing the number of chip pins. (Summary)
