Recently, Lehman Optoelectronics, Unilumin Technology, Longli Technology, Kaisheng Technology, and Delong Laser have successively announced the latest progress of their glass substrate technology on investor interaction platforms.
Lehman Optoelectronics: Glass-based Micro LEDs have entered small-batch trial production.
Lehman Optoelectronics stated that the company has already achieved small-batch trial production of PM-driven glass-based Micro LED display panels, and continues to explore and upgrade glass-based technology by building a pilot plant.
It is reported that Leyard Optoelectronic unveiled the world's first PM-driven glass-based Micro LED display in October 2023. This 220-inch display uses a glass substrate and unique COB packaging technology, balancing display performance and cost.
Unilumin Technology: Glass substrate technology is in the research stage
Regarding its glass substrate technology, Unilumin stated that its glass substrate technology is in the research and development stage, and it has a dedicated R&D team to collaborate with industry leaders in development, and has produced samples for evaluation.
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Longli Technology: Developing Mini/MicroLED technologies, including glass substrates.
Longli Technology stated that the company currently possesses a reserve of technologies related to Mini LED and Micro LED that can utilize various substrates, including glass substrates, and holds corresponding invention patents.
It is understood that Longli Technology focuses on the research, development, production and sales of backlight display modules. Its products are used in consumer products such as mobile phones, tablets, laptops, TVs, and AR/VR; as well as professional display fields such as automotive, industrial control and medical.
Glass substrates are the substrate material of Longli Technology, which have excellent mechanical properties and thermal stability. With the continuous breakthroughs in glass substrate technology and the continuous expansion of Mini LED technology applications, glass substrates are expected to become one of the important substrate materials in the market in the future. The company will plan and apply them according to market demand in the future.
Kaisheng Technology: Semiconductor Packaging Glass Substrates on the Eve of Mass Production
Kaisheng Technology stated that its semiconductor packaging glass substrate has passed verification and is in the final stage before mass production. The company is continuously developing glass-related application technologies and is also paying close attention to the development of TGV-related technologies.
It is understood that Kaisheng Technology's new display business mainly includes a series of products such as ITO conductive film glass, flexible ITO conductive film, glass cover, capacitive touch screen, glass thinning, display module, touch screen module, and integrated display and touch module.
Kaisheng Technology has developed a glass core substrate (GCS) based on glass through-hole 3D interconnect technology (TGV), a novel IC carrier technology that combines the advantages of glass materials and semiconductor processes, and will be used in advanced semiconductor packaging in the future. In addition, Kaisheng Technology will also conduct copper plating processes for TGV through-holes and has ordered laser through-hole equipment from Han's Laser.
Delong Laser: Small batch shipment of TGV equipment
Delong Laser stated that its through-glass via (TGV) laser equipment for advanced packaging glass substrates has already been shipped in small batches. The product is still in the stage of industry and customer expansion, and its revenue accounts for a relatively small proportion.
It is understood that Delong Laser's main products are precision laser processing equipment and lasers. In the semiconductor field, Delong Laser can provide Micro LED peeling/mass transfer equipment, LED/Mini LED wafer laser stress-induced dicing equipment, silicon carbide ingot slicing equipment, laser annealing equipment, etc. (Compiled by Mia)
