Recently, several Micro/Mini LED patent applications have been published by companies such as MTC Semiconductor, Lehman Optoelectronics, HKC, and Huayinxin, covering topics such as improving LED luminous efficiency, enhancing circuit board leveling consistency, reducing mass transfer process requirements, and improving the reliability of high color gamut light-emitting elements.
Jiangxi Zhaochi Semiconductor: Applies for Patent on Low-Voltage Micro-LED Epitaxial Wafer and its Preparation Method <br /> According to information from the State Intellectual Property Office, Jiangxi Zhaochi Semiconductor Co., Ltd. has applied for a patent entitled "Low-Voltage Micro-LED Epitaxial Wafer and its Preparation Method, Micro-LED", with publication number CN119069598A and application date of November 2024.
Image source: State Intellectual Property Office
This invention discloses a low-voltage Micro-LED epitaxial wafer and its fabrication method, relating to the field of semiconductor optoelectronic devices. The low-voltage Micro-LED epitaxial wafer sequentially comprises a substrate, a buffer layer, an undoped GaN layer, an N-type GaN layer, a multiple quantum well layer, an electron blocking layer, a P-type GaN layer, and a P-type contact layer. The P-type contact layer comprises a porous AlInN layer, a two-dimensional P-type BGaN layer, an AlN roughening layer, a P-type BInGaN nanocluster layer, and a P-type AlInGaN roughening layer, sequentially stacked on the P-type GaN layer. The porous AlInN layer is formed by etching the AlInN layer with H2, and the P-type AlInGaN roughening layer is formed by roughening the P-type AlInGaN layer with N2. Implementing this invention can reduce the operating voltage and improve light extraction efficiency, thereby improving luminous efficiency.
MTC Semiconductor, a wholly-owned subsidiary of MTC Corporation, is a high-tech enterprise specializing in the R&D and production of LED epitaxial wafers and chips. It has established independent manufacturing capabilities across the entire process, from sapphire wafers to patterned substrates (PSS) to LED epitaxial wafers and LED chips. In the past three years, MTC Semiconductor's revenue and profits have continued to double, with a production and sales volume reaching 1.1 million wafers per month (4-inch).
Lehman Optoelectronics: Applies for Mini/Micro LED Printed Circuit Board Related Patents to Improve Leveling Consistency <br /> According to information from the State Intellectual Property Office, Huizhou Lehman Optoelectronics Technology Co., Ltd. has applied for a patent entitled "Manufacturing Method of Mini/Micro LED Printed Circuit Board and Lamp Surface Processing Technology", publication number CN119050211A, application date August 2024.
Image source: State Intellectual Property Office
The patent abstract reveals that this invention discloses a lamp surface processing technology for a Mini/Micro LED printed circuit board. The Mini/Micro LED printed circuit board includes a substrate and soldering stations disposed on a lamp surface of one side of the substrate. The lamp surface processing technology includes the following steps: applying dry or wet film to the lamp surface to expose the soldering stations; selectively surface treating the soldering stations; and then performing exposure and development to ultimately dissolve and remove the dry or wet film from the lamp surface. Accordingly, this invention also discloses a method for manufacturing a Mini/Micro LED printed circuit board using the above-described lamp surface processing technology.
The lamp surface processing technology designed in this invention does not include solder mask design when processing the lamp surface of Mini/Micro LED printed circuit boards. This ensures that the LED soldering station is higher than the edge lines, and the surface of the soldering station is a metal surface. Its surface tension and roughness can be controlled, which can ensure good leveling properties of the underfill material during the subsequent underfill process, thereby improving the leveling consistency.
In addition, Lehman Optoelectronics recently stated that the company has achieved small-batch trial production of PM-driven glass-based micro LED display panels. Currently, the company is actively exploring and upgrading glass-based technology and building patent protection barriers around glass-based technology.
HKC: Applies for patent on lamp board and display device to reduce the requirements of Micro LED mass transfer process <br /> According to information from the State Intellectual Property Office, HKC Co., Ltd. has applied for a patent entitled "lamp board and display device", publication number CN119068781A, with an application date of November 2024.
Image source: State Intellectual Property Office
The patent abstract shows that this application discloses a lamp board and a display device, relating to the field of mass transfer technology for LED chips. The lamp board includes a base plate, multiple mounting components, a base circuit board, and multiple LED chips. The mounting components include a main body, an airflow circulation component, a first expansion component, a first force transmission component, and a vibrating plate. The airflow circulation component is interconnected with the first expansion component, and the first force transmission component is drivenly connected to the first expansion component. The base circuit board is disposed on the multiple mounting components, and the LED chips are disposed on the base circuit board. When the base circuit board is working, it generates heat, which heats the gas inside the airflow circulation component. The heated gas expands and enters the first expansion component, causing the first expansion component to expand. This causes the first force transmission component to lift the vibrating plate and push the base circuit board, causing the multiple LED chips located on the base circuit board to vibrate, thereby gradually completing the mass transfer installation of the LED chips. The lamp board of this application completes the mass transfer installation of LED chips through its own structure, reducing the requirements of the mass transfer process for Micro-LEDs.
In May of this year, HKC also published a Micro LED-related patent, which addresses the problem of positional shift that occurs during the transfer of Micro LEDs to the driving substrate.
Huayingxin: Applies for a patent for a high color gamut Mini LED light-emitting element, which can improve the reliability of the light-emitting element . According to information from the State Intellectual Property Office, Huayingxin Semiconductor Co., Ltd. and Huayingxin (Wuhan) Technology Co., Ltd. have applied for a patent entitled "A high color gamut Mini LED light-emitting element and its preparation method and display device", publication number CN119069607A, application date October 2024.
Image source: State Intellectual Property Office
The patent abstract shows that this application provides a high color gamut Mini LED light-emitting element, its fabrication method, and a display device. The high color gamut Mini LED light-emitting element includes an LED chip and a color conversion film. The color conversion film is disposed on the light-emitting side of the LED chip and includes a heat dissipation substrate and a color conversion layer disposed on the side of the heat dissipation substrate opposite to the LED chip. The color conversion layer includes a plurality of color conversion units arranged in an array and a slit disposed between any two adjacent color conversion units, with the slit extending through the color conversion layer in its extension direction. In the high color gamut Mini LED light-emitting element provided by this application, the color conversion layer can improve the color rendering ability of the high color gamut Mini LED light-emitting element, increasing its color gamut. Furthermore, the slits disposed on the heat dissipation substrate that penetrate the color conversion layer can improve the heat dissipation capability of the color conversion layer, thereby improving the reliability of the high color gamut Mini LED light-emitting element.
According to available information, Huayingxin is a leading domestic high-end semiconductor light source IDM manufacturer, and has completed the overall layout of the entire industry chain from chips and packaging to optoelectronic and optical drive integrated light source modules.
Currently, Huayingxin has successfully developed a series of core technologies, such as NCSP white Mini LED light source, and applied them to automotive displays and monitor products of multiple downstream customers.
