Recently, Jingsheng Electronics announced that its independently developed Seal series TGV testing equipment has been successfully delivered in batches to leading customers in the Central China TGV industry, representing a significant breakthrough in the field of advanced packaging testing for semiconductor FOPLP.

This leading customer uses our independently developed TGV (Through Glass Via) technology in Mini/Micro LED direct-view displays, advanced semiconductor sealing plates, and other precision components.
It is understood that TGV technology is a vertical electrical interconnection technology that passes through a glass substrate. It achieves electrical connection by creating tiny vertical through-holes on the glass substrate and filling the through-holes with conductive material.
TGV technology features excellent high-frequency electrical characteristics, readily available large-size ultra-thin glass substrates, low cost, simple manufacturing process, and strong mechanical stability, making it suitable for applications such as 2.5D/3D wafer-level packaging, MEMS sensors, CMOS image sensors, automotive RF and camera modules.
In the field of LED display, Wog Optoelectronics, which focuses on core precision components in optoelectronic display and semiconductor fields, is committed to promoting the application of glass-based TGV technology in Micro LED direct-view displays and advanced semiconductor packaging while focusing on the development and application of Mini LED glass-based COG solutions.
This time, Jingce Electronics provided the customer with its independently developed Seal series TGV inspection equipment, which is mainly used for inspecting key processes such as TGV through holes, surface metallization after hole filling, and RDL manufacturing. The detected defects include pattern abnormalities, surface damage, dirt and foreign matter, short circuits, open circuits, scratches, and residues. Optional integrated modules for key dimension measurement and film thickness measurement are available. This equipment has high inspection accuracy and excellent data processing capabilities, which can accurately capture defects in microstructures and provide detailed inspection reports to help customers improve production efficiency and product quality.
Jingsheng Electronics primarily engages in the research, development, production, and sales of testing systems for displays, semiconductors, and new energy. Our main products in the display field currently cover testing equipment for various display devices, including LCD, OLED, Mini LED, Micro OLED, and Micro LED, encompassing electrical testing and debugging systems, front-end AOI equipment, and integrated automation equipment.
In the first three quarters of this year, Jingce Electronics achieved revenue of RMB 1.831 billion, an increase of 18.50% year-on-year; net profit attributable to the parent company was RMB 82.2411 million, an increase of 752.58% year-on-year.
In the area of LED applications, in September of this year, Jingce Electronics also officially delivered its Micro LED CT AOI inspection equipment to a provincial laboratory customer. (Compiled)