On July 16, Jiangxi Zhaochi Integration, a subsidiary of Zhaochi Co., Ltd., held a line-up ceremony for its optical communication laser epitaxy and chip product line, marking a key step forward in the company's optical communication epitaxy and chip project.
Image source: Zhaochi
The project was initiated in December 2024. Within 7 months, it completed the work from team building to equipment commissioning and established an optical communication chip production line. This marks the company's further improvement of its optical communication business layout and its active embrace of the opportunities of the AI computing power era.
It is understood that in June 2023, MTC Co., Ltd. officially entered the optical communication industry by acquiring MTC Ruigu, focusing on optical devices and optical modules. On December 20, 2024, MTC Group announced the construction of the "Optical Communication Semiconductor Laser Chip Project (Phase I)" and the "Optical Communication High-Speed Module and Optical Device Project (Phase I)".
Among them, the "Optical Communication Semiconductor Laser Chip Project (Phase I)" was undertaken by MTC Integrated Circuits, a subsidiary of MTC Semiconductor. In February 2025, the first batch of core equipment for the project entered the Class 100 workshop, and in June 2025, the first batch of epitaxial wafers were lit up and met the key indicators in one go.
Currently, MTC Integrated Optical Technology's laser epitaxy and chip product line has the capability for mass production of 25G DFB laser chips. The company plans to launch 50G DFB and 100G VCSEL chips in 2026, focusing on the passive optical network (PON) and data center short-distance optical interconnect module market to meet the needs of high-density, low-latency data transmission.
In addition, MTC is simultaneously advancing its silicon photonics and photonic integrated circuit (PIC) technology layout, aiming to build highly integrated optoelectronic solutions for co-packaged optics (CPO) architecture.
This solution will help customers address the challenges of power consumption, bandwidth, and density in 800G/1.6T ultra-high-speed interconnect scenarios through breakthroughs in key technologies such as optoelectronic co-design and heterogeneous integration processes, and provide core optical engine support for next-generation data center optical interconnect infrastructure.
The "High-Speed Optical Communication Modules and Optical Devices Project (Phase I)" aims to cover high-speed optical module technologies and products such as 100G and below, 200G, 400G, and 800G.
On July 7 this year, MTC also announced that its 100G and below optical module products have completed product verification with several leading optical communication equipment manufacturers and have successfully achieved mass production and shipment.
In the future, MTC will continue to increase its R&D investment in 400G/800G and 1.6T high-speed optical modules to provide highly reliable optical transmission solutions for global data centers, AI computing power, and other scenarios. (Compiled)
