The Micro LED industry has attracted considerable attention from investors, becoming a hot investment area. Recently, two companies in the Micro LED field, Suzhou Qiushui Semiconductor Technology Co., Ltd. (hereinafter referred to as "Qiushui Semiconductor") and Shanghai Dianxin Technology Co., Ltd. (hereinafter referred to as "Dianxin Technology"), completed a new round of financing.
Qiushui Semiconductor completes angel round and angel+ round financing
According to "HardKr" reports, Qiushui Semiconductor recently completed tens of millions of RMB in angel and angel+ round financing, led by InnoAngel Fund, with follow-on investments from Lihe Capital, Shanhaiguan Optical Layer, and Digital Optical Core. Xingtang Capital served as its long-term financial advisor. It is understood that the funds raised will primarily be used for the research and development and process verification of Micro LED technology.
According to available information, Qiushui Semiconductor was registered and established in November 2022. Based on its pioneering damage-free Micro LED wafer technology, it integrates advanced 8-inch semiconductor hybrid bonding processes, aiming to solve a series of core challenges in Micro LED technology, such as significant material damage, low optical efficiency, low process yield, and difficulties in colorization. Currently, Qiushui Semiconductor's damage-free technology has successfully verified Micro LED products and has entered the customer sampling stage.
Qiushui Semiconductor's non-destructive technology uses an electrically insulating structure to replace physical insulation, achieving electrical isolation between pixels without any material damage. This technology not only solves the material lifespan problem of high-power digital automotive lighting chips operating in high-temperature environments, but also addresses the inefficiency issue of red Micro LED chips caused by etching damage.
Dianxin Technology Completes New Round of Financing <br /> Following its tens of millions of RMB Pre-A round of financing earlier this year, Dianxin Technology announced the completion of a new round of financing recently. The round was led by Sinan Yuanke Fund under Lingang Group and Xinding Capital, with follow-on investments from Hongfeng Investment and Fangyu Venture Capital. The company also secured loan and investment linkage credit lines from institutions such as Nanjing Bank and China Merchants Bank, obtaining a total of nearly 100 million RMB in equity and debt financing.
According to public information, Dianxin Technology was founded in 2021. The company integrates advanced technologies such as precision optomechanical systems, image processing and AI algorithms, and high-performance computing to develop Micro LED new display and advanced slicing packaging measurement equipment.
Leveraging its understanding of Micro LED mass transfer processes, Dianxin Technology has launched reference-free position measurement and inspection equipment, which has been recognized and used by mainstream Micro LED customers. Simultaneously, Dianxin Technology has developed 2D/3D measurement and inspection equipment specifically for fine RDL and micro bumps in advanced chiplet packaging technology.
Dianxin Technology stated that the funds raised will be used for the large-scale mass production and delivery of equipment, as well as the research and development of new products. Dianxin Technology will continue to focus on the yield management equipment for measurement and testing of emerging micro-nano interconnect processes, develop measurement and testing and electrical measurement solutions with ultra-small contact pitch, and solve key technical challenges in the development of the Micro LED and Chiplet industries.
