Foxconn Technology Group's subsidiary, FIH Mobile, will participate in IAA Mobility 2025, Europe's largest international auto show, from September 9th to 12th. Under the theme of "Driving the Future of Smart Mobility," FIH Mobile will showcase its advanced High-Performance Computing (HPC) platform, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCUs), among other solutions, leveraging its core technologies and integration capabilities to unlock the infinite potential of smart mobility.
Dr. Wen-Yi Kuo, Vice President of FIH, stated, "The global automotive industry is accelerating its electrification, and traditional automakers are facing the challenge of shifting from mechanical dominance to electromechanical design dominance. With over two decades of experience in wireless communications and ICT, as well as its capabilities in mobile phone and IoT product design, manufacturing, and hardware/software integration, FIH can assist traditional automakers in overcoming this transformation hurdle. We provide market-trend-aligned automotive electronics solutions and comprehensive one-stop services to help customers accelerate product adoption and system integration, ushering in a new era of smart mobility."
In response to the increasingly frequent functional updates and rapid iterations required for automotive software, FIH's main product at this exhibition—the evolved HPC—integrates in-vehicle infotainment (IVI) and advanced driver assistance systems (ADAS). It features an evolved Zone Control Unit (ZCU) and Electrical/Electronic Architecture (E/EA) design to enable software upgrades for all vehicle components. Through this forward-looking design, it centralizes computing power and memory, and supports over-the-air (OTA) software updates, realizing a next-generation Software-Defined Vehicle (SDV) solution.
FIH will also showcase Taiwan's first 4G TCU to pass EU eCall (Emergency Call) certification and already a stable supplier to globally renowned automotive groups, as well as a new version of the 5G TCU with 5G connectivity, enabling cloud integration, real-time data transmission, and remote diagnostics. FIH TCU products received ASPICE CL2 certification in 2024 and have subsequently obtained ISO26262, UN ECE R155 Cybersecurity, and R156 OTA security certifications, demonstrating superior quality and reliability.
To address the dual challenges of system integration and rapid software iteration faced by the automotive industry, FIH offers a one-stop integrated service covering the entire process from product design, manufacturing, mass production, and implementation. It also supports cross-system debugging to resolve incompatibility issues between automotive electronic control units (ECUs), ensuring seamless collaboration and operation of electronic components. Furthermore, FIH accelerates software releases through agile software development processes and provides real-time software upgrades via OTA deployment capabilities, ensuring drivers enjoy the latest features and an optimized experience.
In the future, FIH will continue to deepen its layout in three core business areas, expand its footprint in smart manufacturing, automotive electronics, and equipment/robotics, and provide high-quality services and create outstanding value for global customers through the flexibility of its global layout and flexible production strategies.
FIH's main products at this exhibition include evolved HPC, ADAS, and TCU, leveraging core technologies and integration capabilities to unlock the infinite potential of smart mobility.
