On June 18, South Korean media ET NEWS reported that BOE is advancing its semiconductor glass substrate business and expanding into the semiconductor field based on its accumulated glass substrate technology in the display industry.
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According to South Korean media reports, a recent public bidding information website in China shows that BOE has ordered equipment for semiconductor glass substrates, including automated optical inspection (AOI) and electroless copper plating.
The AOI equipment was selected from Onto Innovation, a US company; while the adhesive removal equipment, electroless copper plating equipment, and bonding promotion equipment were selected from domestic companies. The equipment is used for the "Glass-based Packaging Substrate R&D Test Line Project".
In its tender documents, BOE stated that the purpose of purchasing glass-based process equipment and exposure equipment is to establish a research and industrialization testing line for glass-based packaging technology, verify the process technology of glass-based integrated circuit (IC) packaging substrates and achieve industrialization, improve chip performance, and realize large-scale packaging. This means that the equipment is not intended for display production, but for the semiconductor packaging field.
Semiconductor glass substrates are known to have smoother and thinner surfaces than traditional substrates, enabling the implementation of more intricate circuits. Furthermore, due to less thermal warpage, they are suitable for high-performance, highly integrated semiconductor applications where heat generation is significant. However, due to the inherent properties of glass, even minor cracks can have adverse effects, making its development extremely challenging. Currently, semiconductor glass substrates are not yet commercially available.
South Korean media believe that BOE's business is not limited to traditional display products such as liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs), but also shows interest in semiconductor glass substrates. Glass processing technology determines the competitiveness of semiconductor glass substrate products, and BOE, as a display company that uses glass substrates extensively, can leverage its existing supply chain to create its own advantages.
According to South Korean media reports, industry insiders revealed that rumors of BOE's plans to enter the semiconductor glass substrate business have been circulating since the second half of last year. It appears that the business has now entered the equipment supplier selection phase. (Source: TrendForce Display)
